Cutting Machinery
LG500PlatformDirectionaSlicer
This machine is designed and manufactured in accordance with the increasing requirements of market product quality.
According to the size of the material, choose the appropriate inlet, manually forward, one material after another, and manually press into the inlet. Bananas, wafers, ovals do not need to be pressed by hand.
It has the characteristics of accurate orientation, adjustable sheet thickness, consistent thickness, and good finish.
Suitable for carrots, incense sticks, onion rings, apple rings, lotus root, burdock, yam, bamboo shoots, sweet oranges and other potato, ball, root fruit and vegetable materials.
Feed hole:
1. Normally supply feed hole specifications Φ76, Φ63, Φ51, Φ38, 2 holes each or order according to user needs.
2. The slice shape of the oblique installation of the inlet is an ellipse, and it is produced according to the users order specifications.
3. It can also be made into an oval-shaped inlet according to the material.
Dimensions: 1000 × 620 × 1000mm. Weight: 70kg
Note: There should be no hard objects such as stones.
This series of products are guaranteed for one year and lifetime maintenance service.
- 70 kg
重量 - 300-1000 Kg / h
产量 - 0.75Kw
功率 - 370 × 270 mm
外形尺寸
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LG500PlatformDirectionaSlicer
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LG500PlatformDirectionaSlicer
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LG500PlatformDirectionaSlicer
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LG500PlatformDirectionaSlicer
Weight: 70 kg
Ground height: 370 mm
Motor: Y90S-6
Cut shape specification: 1.6-30 mm
Power: Cutting 0.75Kw
Capacity: 300-1000 Kg / h
Exit size: 370 × 270 mm
Feeding trough: φ22-φ76 can be customized
Weight: 100Kg aluminum plate 3Kg arc knife
Dimensions: 1010 × 610 × 940 mm
Cut 2 bananas Φ38, 4-Φ38, spare Φ51, Φ63.
The slice thickness is 1-6mm. Adjust with a shim. Thickness = height of cutting edge.
This machine is designed and manufactured in accordance with the increasing requirements of market product quality.
According to the size of the material, choose the appropriate inlet, manually forward, one material after another, and manually press into the inlet. Bananas, wafers, ovals do not need to be pressed by hand.
It has the characteristics of accurate orientation, adjustable sheet thickness, consistent thickness, and good finish.
Suitable for carrots, incense sticks, onion rings, apple rings, lotus root, burdock, yam, bamboo shoots, sweet oranges and other potato, ball, root fruit and vegetable materials.
Feed hole:
1. Normally supply feed hole specifications Φ76, Φ63, Φ51, Φ38, 2 holes each or order according to user needs.
2. The slice shape of the oblique installation of the inlet is an ellipse, and it is produced according to the users order specifications.
3. It can also be made into an oval-shaped inlet according to the material.
Dimensions: 1000 × 620 × 1000mm. Weight: 70kg
Note: There should be no hard objects such as stones.
This series of products are guaranteed for one year and lifetime maintenance service.
LG500PlatformDirectionaSlicer
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